High Precision Multilayer PCB, PCB with High Quality, PCB Manufacturing Service manufacturer / supplier in China, offering PCB Board for 6 Layer Large Size BGA, 6 Layer PCB for Electronic Products, Double Sided PCB for Computer Keys and so on.
Min. Order / Reference FOB Price | |
---|---|
100 Piece | US $8.00/ Piece |
Local Area: | Beijing, China |
---|---|
R&D Capacity: | OEM, ODM, Other |
Payment Terms: | LC, T/T, PayPal |
Brand: | Sy |
---|---|
Type: | Rigid Circuit Board |
Dielectric: | FR-4 |
Material: | Fiberglass Epoxy Resin + Polyimide Resin |
Capabilities-FPCN0ItemsParameterN0ItemsParameter1Layers CountsFPC:2-6LRFPC:2-10L14Min.inner design line width/clearance T/TOZ 1.6mil/1.6min(0.04mm/0.04mm)
H/HOZ 2.0mil/2.0min(0.05mm/0.05mm)
1/1OZ 3mil/3min(0.075mm/0.05mm)2Max Fabrication area19.7"x19.7" (500mmx500mm)153Major material brandsDoosanThinflexShengyiTaiyoDongYi164Finished board thickness tolerance±10%
±0.03mm (Board thickness≤0.2mm)
±0.05mm(Board thickness≤0.5mm17Min. external design line width/clearance T/TOZ 2.0mil/2.0min(0.05mm/0.05mm)
H/HOZ 3.0mil/3.0min(0.075mm/0.075mm)
1/1OZ 4.0mil/4.0min(0.1mm/0.1mm)5Separated layer structure/buried and blinded via holeYES186Min hole diameterMachanical drilling size:0.1mm~6.5mm Laser drilling size:0.1-0.125mm19Min.solder mask dam width 2.5mil(0.064mm)7base copper thickness of outer1/3 OZ-1OZ (0.012mm-0.035mm)20Soldermask registration tolerance±2mil(±0.05mm)8base copper thickness of inner1/3 OZ-1OZ (0.012mm-0.035mm)21Min. coverlay dam width8mil(0.2mm)9Board thickness0.07-2.0mm22Coverlay registration tolerance±6mil(±0.15mm)10Max hole plating Aspect ratio8:0123Min. routing tolerance(hole-edge)(min))±4mil(±0.1mm)11Hole Size Tolerance (PTH)±3mil(±0.075mm)24Min test abilityPAD Size min(0.1mm) PAD Pitch min(0.4mm)12Hole Size Tolerance (NPTH) ±1mil(±0.025mm)25Reinforcement typePIFR4SUS13Hole wall copper thickness10um min or on the basis of customer's requestment26Electro-magnetic shielding processElectro-magnetic shielding film/Silver past silkscreen printingCapabilities-PCBN0ItemsParameterN0ItemsParameter1Layers Counts2-26L14Min.inner design line width/clearance H/HOZ 2.0mil/2.0min
1/1OZ 2mil/2min
2/2OZ 3mil/3min
3/3OZ 3mil/3min2Max Fabrication area21.5"x24.5" (700mmx700mm)153MaterialFR4(130ºCTg-180CTg),CM3,Halogen-free164Finished board thickness tolerance±10%
±3 mil(thickness≤0.8mm)Board Thickness≤0.8mm
±0.05mm(thickness<thickness≤0.5mm17Min. external design line width/clearance H/HOZ 2.0mil/2.0min
1/1OZ 2mil/2min
2/2OZ 3mil/3min
3/3OZ 4mil/4min5Min bendability ≤0.7%186Drillig hole diameter 0.005"~0.255" (0.15mm-6.5mm)19Min.solder mask dam width 2.0mil7base copper thickness of outer1/3 OZ-8OZ 20Soldermask registration tolerance±4mil(±0.101mm)8base copper thickness of inner1/2 OZ-8OZ 21Solder rmask hardness>6H9Board thickness0.3-6.0mm22Thermal shock288ºC 10second (3times)10 Max.hole plating Aspect ratio10:0123Ionic cleanliness test<1.56ug/cm2(NaCI)11Hole Size Tolerance (PTH) ±3mil(±0.075mm)24Peel strength ≥1.4N/mm12Hole Size Tolerance (NPTH) ±1mil(±0.025mm)25 Characteristic impedance control±8%13Hole wall copper thickness≥0.8min(≥0.020mm)26Surface finishIingOSP,Immersion gold,Lead-free HASL,Plating gold,Carbon ink ,Peelable solder mask ink ect.
Product delivery capability
LayersThrough-Hole 2-4LFirst Order HDISecond Order HDIThird Order HDIArea4-8L10-14L4-8L10-14L16-18L6-8L10-14L16-18L8-10L12-14L16-18L≤0.3M29-12 Days13-1512-1516-1718-2014-1617-1920-2216-1819-2122-240.3-3M210-13 Days14-1613-1617-1819-2115-1718-2021-2317-1920-2223-253-10M211-14 Days15-1714-1718-1920-2216-1819-2122-2418-2021-2324-26>10M214-16 Days17-1920-2223-2526-2821-2324-2627-3025-2830-3535-40